Supporting Precision Manufacturing Through Grinding
& Polishing Technologies
YACHIYO MICROSCIENCE INC. (YMI)
For Those Dedicated to Precision Polishing
Cerium oxide polishing material（MIREK）
Cerium oxide polishing material. Suitable for processes ranging from edge chamfering to final polishing. Delivers stable precision and excellent cleanability.
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Precision Polishing Pads(BELLATRIX)
Improve surface roughness and edge geometry, enhancing yield and consistency in precision machining processes.
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Fixed-Abrasive Tool(BRILLER MEULE)
A fixed-abrasive tool that achieves up to three times higher material removal rates. Easy to replace, reducing operator burden while improving productivity and quality.
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PAD CONDITIONING TOOLS
Exceptional lightweight design combined with superior lapping plate correction capability. Achieves both improved yield and enhanced operability.
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