Toward the Ultimate Glass Polishing
A polishing material engineered to fully leverage the intrinsic properties and chemical characteristics of glass.
Used in optical lenses, FPD mask blanks, and other glass products, MIREK™ holds a 50% domestic market share in Japan.
Why not experience the trusted performance of MIREK™, a proven cerium oxide polishing material?
MIREK™ is a cerium oxide polishing material designed to maximize the inherent properties of glass, achieving an optimal balance between chemical action and mechanical polishing performance.
With industry-leading polishing efficiency, along with outstanding safety and stability, MIREK™ helps solve productivity and quality challenges in manufacturing environments.
1・Features & Reliability of MIREK™
１・Proven Track Record and Long-Term Trust
MIREK™ has a history of over 50 years since its initial release and holds more than 50% market share in the domestic Japanese market.
It has been widely adopted by leading domestic optical lens manufacturers and photomask blank manufacturers, among many others.
Chosen consistently over the long term, MIREK™ is highly regarded within the industry for its quality, reliability, and proven performance.
２・High-Quality Cerium Oxide with Precise Classification
MIREK™ is a high-quality cerium oxide polishing material produced using carefully selected raw materials and high-precision particle classification.
Compared with conventional products, it delivers stable and consistent polishing performance over extended use.
３・Lineup Customized to Customer Requirements
MIREK™ is available in a range of formulations optimized for specific applications and operating environments, with tailored particle sizes and additive compositions.
Its excellent dispersion and re-dispersion properties contribute to stable removal rates, while enhanced cleanability is particularly effective in processes where residue removal is critical.
For customers experiencing issues with material adhesion to workpieces or polishing equipment, MIREK™ is strongly recommended.
４・Thorough Quality Control Through 100% Lot Inspection*
MIREK™ is manufactured under one of the most stringent quality standards in the industry, ensuring high reliability and consistency.
All production lots undergo comprehensive inspection at our R&D Center, including checks of polishing performance, particle size distribution, and residual content.Only lots that meet all inspection criteria are approved for shipment.
This rigorous process minimizes quality variation and reduces physical property differences between lots, ensuring stable performance in production environments.
２・Application Examples & Performance Records
Case 1: Polishing of Quartz Wafers
Application / Grade:
Replacement for colloidal silica / HL020CS slurry
Challenge:
The high pH of colloidal silica caused corrosion of metal components in polishing equipment.
Solution:
We proposed HL020CS, which features a stable pH profile.
Result:
Dry adhesion was significantly reduced, and the material was adopted as an equipment-friendly polishing solution.
Operational efficiency improved.
Case 2: Polishing of Optical Lenses
Application / Grade:
General optical lenses / HLSS-6
Challenge:
An increasing variety of glass materials made setup and process changeovers complex.
Solution:
We proposed HLSS-6, a versatile polishing material suitable for a wide range of optical lenses.
Result:
Material changes were no longer required even when glass types differed, leading to improved productivity and yield.
Stable polishing performance also ensured consistent lens surface quality.
Case 3: Polishing of Mask Blanks for LSI and FPD
Application / Grade:
FPD mask blanks / HL21-G
Challenge:
A decline in polishing rate resulted in reduced productivity.
Solution:
We proposed HL21-G, featuring a particle size one grade larger than the previous material.
Result:
The polishing rate increased significantly, improving production efficiency by 30%.
The product has been continuously used for over three years since the changeover.
Case 4: Re-polishing of Smartphone Cover Glass
Application / Grade:
Smartphone cover glass / HLS0-7
Challenge:
Insufficient removal rate with competitor products.
Solution:
We proposed HLS0-7, designed for high removal-rate applications.
Result:
Removal rates increased, processing time was reduced, and overall productivity improved.
Case 5: Polishing of Quartz Glass
Application / Grade:
Sensor components / HL0S + HL21
Challenge:
Insufficient flatness and surface roughness.
Solution:
A two-step polishing process was adopted.
Flatness was achieved using HL21, which has a sharp particle size distribution, followed by surface roughness improvement using HL0S.
MIREK™ is also widely adopted as an alternative to colloidal silica.
Cerium oxide–based slurries are particularly valued for their pH stability and low tendency for dry adhesion, making them ideal for polishing quartz wafers and glass substrates.
Compound Semiconductors / SiC-Compatible Slurries
CMP slurry for SiC wafer polishing, “Nanovix”, is also available.
With a product lineup designed to support next-generation technologies, we are ready to meet a wide range of processing needs.
３・Customer Feedback
“Our yield rate improved, leading to higher production efficiency.”
“The polishing rate exceeded our expectations and contributed to cost reduction.”
“Surface quality has improved significantly, and our clients are very satisfied.”
“We trust MIREK™. We have been long-time users of this product.”
“In the end, MIREK™ consistently delivers the best results.”
“Cleaning processes have become much easier.”
“MIREK™ offers not only high product quality, but also strong support, including advance order confirmation and timely updates on supply conditions influenced by global market situations.”
“Rare earth materials often raise concerns regarding export restrictions and supply risks, but YACHIYO keeps us informed of the latest conditions at all times, which gives us great peace of mind.”
※Quality Assurance Policy
We maintain strict quality control standards at all times.
Every production lot undergoes actual test polishing, along with multiple inspections such as surface defect checks and residue inspection.
Only products that meet all quality criteria are approved for shipment.
If you experience any issues, please do not hesitate to contact us.
4・Frequently Asked Questions (FAQ)
Q1：Can I evaluate the product before purchasing?
A：Yes.
Free samples are available. Please apply through our inquiry form.
Q2：What materials is MIREK™ suitable for?
A：Optical lenses, LCD panels, quartz wafers, fused quartz glass, and smartphone cover glass.
It is particularly suitable for precision applications requiring high-quality surface finishes.
Q3：What types of additives are included?
A：Customized additives to improve dispersion, re-dispersion, and cleanability.
Formulations can be adjusted upon request.
Q4：I would like to increase the polishing rate.
A：Products with optimized particle size or additive-enhanced formulations can be proposed after reviewing your current process.
Q5：What is the typical lead time?
A：Approximately 2 weeks to 1 month. Advance notice allows flexible support.
Q6：I would like to suppress foam generation.
A：Products with excellent dispersion and re-dispersion properties are available.
Please feel free to contact us for further details.
５.Polishing Process and Usage
Basic Polishing Process
The polishing process is generally divided into two steps.
P1／Primary Polishing：
Smooths surface roughness from the previous process and establishes flatness.
P2／Secondary Polishing：
Refines surface roughness while maintaining the flatness achieved in P1.
Using different grades of MIREK™ with appropriate particle sizes at each stage ensures optimal finishing.
Simplified One-Step Process
Depending on production requirements, MIREK™ can also support single-step polishing processes.
Customization Based on Process Requirements
Customized solutions are available for cases such as:
・Completing rough polishing and finishing in one step
・Achieving high-quality results under time or cost constraints
By optimizing particle size and additive selection, efficient polishing processes can be realized.
Products suitable for edge polishing are also available.
Usage Guidelines：
・Mix the powder with deionized (pure) water and agitate thoroughly
・Recommended concentration: 10–20% (adjust as needed)
・Continuous agitation during processing is essential
We are happy to propose optimal conditions tailored to your process, so please feel free to contact us.