Company Information

Date established November, 1937
Representative Hidenori Aoki , President
Capital JPY 10 million
Number of Employees 21 (As of February, 2023)
Main Customer ASAHI GLASS CO., LTD.
Canon Inc.
Namiki Precision Jewel Co., Ltd.
Shin-Etsu Chemical Co., Ltd.
Address Head Office
29-6, Kanda Higashimatsushita-cho, Chiyoda-ku, Tokyo, 101-0042, Japan
Phone +81-3-3256-6011
FAX +81-3-3252-0930

Osaka Branch Office
Kita-ku, Osaka-shi, Osaka

Research and Development Center
Hachioji-shi, Tokyo

Contact If you have any questions, please contact us by e-mail. contact@ymi.co.jp

Company History

1937 Established as distributor of Painting Materials and Chemicals.
1960s Launched sales of Abrasive Powders and Polishing Pad.
1990s Launched sales of Division-Style Diamond Tool for Lapping Machine.
October, 2012 Obtained ISO9001 certification.


We, Yachiyo Microscience Inc., are not only the trading company of polishing and lapping items and materials with more than 70 years experiences, but are also trying to develop new products of this fields at our Research and Development Center.

Diamond Tool for Grinding and Lapping “Briller Meule”

This Diamond Tool is the most appropriate method for the grinding and lapping by using double-sided machine to glass and ceramics. There is the use of the Diamond grindstones for separated pieces of plate for double-sided machine platen.
This tool can make high precision of flatness grinding and lapping for any kinds of glass and ceramics.
It should be making innovation of efficiency in your factory.

Diamond Tool

Cerium Oxide Abrasive Powders “MIREK™”

We offer you Cerium Oxide Abrasive Powder “MIREK” for polishing hard disk substrate, liquid crystal panel, photo mask substrate, eye glasses, precision optical lens, and other glass.
There are many grain diameter for any process of polishing.

Diamond Pellet “MIDIA”

This diamond pellet is used for heavy and fine grinding and lapping of many materials.
You will be able to find the optimum type of diamond pellet for optical glass, crystal, ceramics, ferrite, metal, and others.

Precision Polishing Pad

There are abundant variety of polishing pad for silicon wafer, semiconductor materials, photo mask substrate, hard disk substrate, and other glass.
They are the most appropriate to use for ultra-precision polishing.
We have nonwoven type, suede type, and others.

Grinding and Lapping Lubricant “DIA-CUT”

This is our original Lubricant for any glass and ceramics.
It makes growing efficiency of grinding and lapping.
We offer you the following 4 kinds of “DIA-CUT” lineup which depends on what you need for.
・Type S : for various optical materials (pH7.8)
・Type E : environmental consideration type without triethanolamine (pH7.2)
・Type W : for sapphire & SiC substrate (pH8.6)
・Type F : for resinoid diamond tools without triethanolamine (pH8.6)

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